A QFN EMC LED package is a plastic LED package that shares a lot in common with the architecture of plastic leaded chip carrier (PLCC) mid-power packages but comes with improved thermal stability and interconnect reliability. QFN is short for Quad Flat No-lead. A QFN package is designed in a way that its anode/cathode pads are integrated into the bottom of the package, rather than using traditional leads formed along the perimeter of the package. The exposed anode/cathode pads on the bottom of the package provides increased interface area that can maximize solder joint reliability and thermal transfer capacity while contributing to a reduced footprint. EMC stands for epoxy molding compound. EMC plastics have better thermal performance and photostability than polyphthalamide (PPA) and polycyclohexylenedimethylene terephthalate (PCT). Improved resistance to discoloration at higher temperatures makes EMC LED packages a low-cost alternative to high power LED packages for industrial and outdoor applications where PLCC packages are unable to survive the moderately high operating temperatures while high power packages are overqualified for the job.